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8M x 8-Bit Dynamic RAM (4k & 8k Refresh, EDO-version)
HYB 3164805J/T(L) -50/-60 HYB 3165805J/T(L) -50/-60
Preliminary Information
* * *
*
* *
* * * * *
8 388 608 words by 8-bit organization 0 to 70 C operating temperature Fast access and cycle time RAS access time: 50 ns (-50 version) 60 ns (-60 version) Cycle time: 84 ns (-50 version) 104 ns (-60 version) CAS access time: 13 ns ( -50 version) 15 ns ( -60 version) Hyper page mode (EDO) cycle time 20 ns (-50 version) 25 ns (-60 version) Single + 3.3 V ( 0.3V) power supply Low power dissipation max. 396 active mW ( HYB 3164805J/T(L)-50) max. 360 active mW ( HYB 3164805J/T(L)-60) max. 504 active mW ( HYB 3165805J/T(L)-50) max. 432 active mW ( HYB 3165805J/T(L)-60) 7.2 mW standby (TTL) 720 W standby (MOS) 14.4 mW Self Refresh (L-version only) Read, write, read-modify-write, CAS-before-RAS refresh (CBR), RAS-only refresh, hidden refresh and self refresh modes Hyper page mode (EDO) capability 8192 refresh cycles/128 ms , 13 R/ 11C addresses (HYB 3164805J/T(L)) 4096 refresh cycles/ 64 ms , 12 R/ 12C addresses (HYB 3165805J/T(L)) Plastic Package: P-SOJ-34-1 500 mil HYB 3164(5)805J P-TSOPII-34-1 500 mil HYB 3164(5)805T(L)
Semiconductor Group
149
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
This HYB3164(5)805 is a 64 MBit dynamic RAM organized 8 388 608 x 8 bits. The device is fabricated in SIEMENS/IBM most advanced first generation 64Mbit CMOS silicon gate process technology. The circuit and process design allow this device to achieve high performance and low power dissipation. The HYB3164(5)805 operates with a single 3.3 +/-0.3V power supply and interfaces with either LVTTL or LVCMOS levels. Multiplexed address inputs permit the HYB 3164(5)805 to be packaged in a 500mil wide SOJ-34 or TSOP-34 plastic package. These packages provide high system bit densities and are compatible with commonly used automatic testing and insertion equipment.The HYB3164(5)805TL parts have a very low power sleep mode" supported by Self Refresh. Ordering Information Type HYB 3164805J-50 HYB 3164805J-60 HYB 3164805T-50 HYB 3164805T-60 Ordering Code on request on request on request on request Package P-SOJ-34-1 P-SOJ-34-1 P-TSOPII-34-1 P-TSOPII-34-1 P-TSOPII-34-1 P-TSOPII-34-1 P-SOJ-34-1 P-SOJ-34-1 P-TSOPII-34-1 P-TSOPII-34-1 P-TSOPII-34-1 P-TSOPII-34-1 Descriptions 500 mil DRAM (access time 50 ns) 500 mil DRAM (access time 60 ns) 500 mil DRAM (access time 50 ns) 500 mil DRAM (access time 60 ns) 500 mil DRAM (access time 50 ns) 500 mil DRAM (access time 60 ns) 500 mil DRAM (access time 50 ns) 500 mil DRAM (access time 60 ns) 500 mil DRAM (access time 50 ns) 500 mil DRAM (access time 60 ns) 500 mil DRAM (access time 50 ns) 500 mil DRAM (access time 60 ns)
HYB 3164805TL-50 on request HYB 3164805TL-60 on request HYB 3165805J-50 HYB 3165805J-60 HYB 3165805T-50 HYB 3165805T-60 on request on request on request on request
HYB 3165805TL-50 on request HYB 3165805TL-60 on request Pin Names A0-A12 A0-A11 RAS OE I/O1-I/O8 CAS WRITE Vcc Vss
Address Inputs for HYB 3164805J/T(L) Address Inputs for HYB 3165805J/T(L) Row Address Strobe Output Enable Data Input/Output Column Address Strobe Read/Write Input Power Supply ( + 3.3V) Ground
Semiconductor Group
150
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
P-SOJ-34-1 (500 mil) P-TSOPII-34-1 (500 mil)
Pin Configuration
Semiconductor Group
151
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
TRUTH TABLE
FUNCTION Standby Read Early-Write Delayed-Write Read-Modify-Write Hyper Page Mode Read 1st Cycle 2nd Cycle Hyper Page Mode Write 1st Cycle 2nd Cycle Hyper Page Mode RMW 1st Cycle 2st Cycle RAS only refresh CAS-before-RAS refresh Test Mode Entry Hidden Refresh READ WRITE Self Refresh (L-version only)
RAS H L L L L L L L L L L L H-L H-L L-H-L L-H-L H-L
CAS H-X L L L L H-L H-L H-L H-L H-L H-L H L L L L L
WRITE X H L H-L H-L H H L L H-L H-L X H L H L H
OE X L X H L-H L L X X L-H L-H X X X L X X
ROW ADDR X ROW ROW ROW ROW ROW n/a ROW n/a ROW n/a ROW X X ROW ROW X
COL ADDR X COL COL COL COL COL COL COL COL COL COL n/a n/a n/a COL COL X
I/O1I/O4 High Impedance Data Out Data In Data In Data Out, Data In Data Out Data Out Data In Data In Data Out, Data In Data Out, Data In High Impedance High Impedance High Impedance Data Out Data In High Impedance
Semiconductor Group
152
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
Block Diagram for HYB 3165805J/T(L)
Semiconductor Group
153
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
Block Diagram for HYB 3164805J/T(L)
Semiconductor Group
154
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
Absolute Maximum Ratings Operating temperature range..............................................................................................0 to 70 C Storage temperature range.........................................................................................- 55 to 150 C Input/output voltage..................................................................................-0.5 to min (Vcc+0.5,4.6) V Power supply voltage....................................................................................................-0.5V to 4.6 V Power dissipation......................................................................................................................1.0 W Data out current (short circuit)..................................................................................................50 mA
Note
Stresses above those listed under Absolute Maximum Ratings" may cause permanent damage of the device. Exposure to absolute maximum rating conditions for extended periods may effect device reliability.
DC Characteristics TA = 0 to 70 C, VSS = 0 V, VCC = 3.3 V 0.3 V, (values in brackets for HYB 3165805J/T) Parameter Input high voltage Input low voltage Output high voltage (LVTTL) Output H" level voltage (Iout = -2mA) Output low voltage (LVTTL) Output L"level voltage (Iout = +2mA) Output high voltage (LVCMOS) Output H" level voltage (Iout = -100uA) Ouput low voltage (LVCMOS) Output L" level voltage (Iout = +100uA) Input leakage current,any input
(0 V < Vin < Vcc , all other pins = 0 V
Symbol
Limit Values min. max. Vcc+0.3 0.8 - 0.4 2.0 - 0.3 2.4 -
Unit Note V V V V V V A A 1) 1)
VIH VIL VOH VOL VOH VOL II(L) IO(L) ICC1
-50 ns version -60 ns version
Vcc-0.2 -2 -2 0.2 2 2
Output leakage current
(DO is disabled, 0 V < Vout < Vcc )
Average Vcc supply current:
- -
110 (140) mA 100 (120) mA 2 mA
2) 3) 4)
(RAS, CAS, address cycling: tRC = tRC min.)
Standby Vcc supply current
(RAS=CAS= Vih)
ICC2
-
-
Semiconductor Group
155
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
DC Characteristics (cont'd) TA = 0 to 70 C, VSS = 0 V, VCC = 3.3 V 0.3 V, (values in brackets for HYB 3165805J/T) Parameter Symbol Limit Values min. Average Vcc supply current, during RAS-only ICC3 refresh cycles: -50 ns version -60 ns version
(RAS cycling: CAS = VIH: tRC = tRC min.)
Unit Note
max. 110 (140) mA 100 (120) mA 2) 4)
- -
Average Vcc supply current, during
hyper page mode (EDO): -50 ns version -60 ns version
ICC4
- - 115 (150) mA 100 (120) mA 200 A 2) 3) 4)
(RAS = VIL, CAS, address cycling: tHPC=tHPC min.)
Standby Vcc supply current
(RAS=CAS= Vcc-0.2V)
ICC5
-
-
Average Vcc supply current, during CAS-before- ICC6 RAS refresh mode: -50 ns version -60 ns version
(RAS, CAS cycling: tRC = tRC min.)
- - -
110 (140) mA 100 (120) mA 400 A
2) 4)
Self Refresh Current (L-version only)
Average Power Supply Current during Self Refresh. (CBR cycle with tRAS>TRASSmin, CAS held low, WE = Vcc-0.2V, Address and Din=Vcc-0.2V or 0.2V)
ICC7
Capacitance TA = 0 to 70 C,VCC = 3.3 V 0.3 V, f = 1 MHz Parameter Input capacitance (A0 to A11,A12) Input capacitance (RAS, CAS, WRITE, OE) I/O capacitance (I/O1-I/O8) Symbol Limit Values min. max. 5 7 7 pF pF pF - - - Unit
CI1 CI2 CIO
Semiconductor Group
156
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
AC Characteristics 5)6) TA = 0 to 70 C,VCC = 3.3 V 0.3V , tT = 2 ns Parameter
Symbol
Limit Values -50 min. max. min. -60 max.
Unit
Note
common parameters
Random read or write cycle time RAS precharge time RAS pulse width CAS pulse width Row address setup time Row address hold time Column address setup time Column address hold time RAS to CAS delay time RAS to column address delay time RAS hold time CAS hold time CAS to RAS precharge time Transition time (rise and fall) Refresh period for HYB3164805 Refresh period for HYB3165805 tRC tRP tRAS tCAS tASR tRAH tASC tCAH tRCD tRAD tRSH tCSH tCRP tT tREF tREF 84 30 50 8 0 8 0 8 12 10 8 45 5 1 - - - 50 128 64 - - 100k 10k - - - - 37 25 104 40 60 10 0 10 0 10 14 12 10 50 5 1 - - - - 100k 10k - - - - 45 30 - - - 50 128 64 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ms 7
Read Cycle
Access time from RAS Access time from CAS Access time from column address OE access time Column address to RAS lead time Read command setup time Read command hold time tRAC tCAC tAA tOEA tRAL tRCS tRCH - - - - 25 0 0 0 50 13 25 13 - - - - - - - - 30 0 0 0 60 15 30 15 - - - - ns ns ns ns ns ns ns ns 11 11 8, 9 8, 9 8,10
Read command hold time referenced to tRRH RAS
Semiconductor Group
157
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
AC Characteristics (cont'd) 5)6) TA = 0 to 70 C,VCC = 3.3 V 0.3V , tT = 2 ns Parameter
Symbol
Limit Values -50 min. max. - 13 13 - - - - min. 0 0 0 0 0 15 15 -60 max. - 15 15 - - - -
Unit
Note
CAS to output in low-Z Output buffer turn-off delay Output buffer turn-off delay from OE Data to CAS low delay Data to OE low delay CAS high to data delay OE high to data delay
tCLZ tOFF tOEZ tDZC tDZO tCDD tODD
0 0 0 0 0 13 13
ns ns ns ns ns ns ns
8 12 12 13 13 14 14
Write Cycle
Write command hold time Write command pulse width Write command setup time Write command to RAS lead time Write command to CAS lead time Data setup time Data hold time tWCH tWP tWCS tRWL tCWL tDS tDH 8 7 0 8 8 0 7 - - - - - - - 10 10 0 10 10 0 10 - - - - - - - ns ns ns ns ns ns ns 16 16 15
Read-modify-Write Cycle
Read-write cycle time RAS to WE delay time CAS to WE delay time Column address to WE delay time OE command hold time tRWC tRWD tCWD tAWD tOEH 111 67 30 42 7 - - - - - 135 79 34 49 10 - - - - - ns ns ns ns ns 15 15 15
Hyper Page Mode (EDO) Cycle
Hyper page mode (EDO) cycle time CAS precharge time Access time from CAS precharge Output data hold time RAS pulse width in hyper page mode tHPC tCP tCPA tCOH tRAS 20 8 - 5 50 - - 27 - 200k 25 10 - 5 60 - - 35 - 200k ns ns ns ns ns 7
Semiconductor Group
158
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
AC Characteristics (cont'd) 5)6) TA = 0 to 70 C,VCC = 3.3 V 0.3V , tT = 2 ns Parameter
Symbol
Limit Values -50 min. max. - - - - 10 min. 35 10 10 10 0 -60 max. - - - - 10
Unit
Note
CAS precharge to RAS Delay OE pulse width OE hold time from CAS high
tRHCP tOEP tOEHC
27 7 7 7 0
ns ns ns ns ns
WE pulse width to output disable at CAS tWPZ high Output buffer turn-off delay from WE tWPZ
Hyper Page Mode (EDO) Readmodify-Write Cycle
Hyper page mode (EDO) read-write cycle time CAS precharge to WE tPRWC tCPWD 51 41 - - 66 49 - - ns ns
CAS before RAS refresh cycle
CAS setup time CAS hold time RAS to CAS precharge time Write to RAS precharge time Write hold time referenced to RAS tCSR tCHR tRPC tWRP tWRH 5 8 5 8 8 - - - - - 5 10 5 10 10 - - - - - ns ns ns ns ns
CAS-before-RAS counter test cycle
CAS precharge time (CAS-before-RAS counter test cycle) tCPT 35 - 40 - ns
Self Refresh Cycle
RAS pulse width during self refresh CAS hold time during self refresh tRASS tCHS 100k 84 -50 _ _ _ 100k 104 -50 _ _ _ ns ns ns 17 17 17 RAS precharge time during self refresh tRPS
Semiconductor Group
159
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
AC Characteristics (cont'd) 5)6) TA = 0 to 70 C,VCC = 3.3 V 0.3V , tT = 2 ns Parameter
Symbol
Limit Values -50 min. max. - - min. 10 10 -60 max. - -
Unit
Note
Test Mode
Write command setup time Write command hold time tWTS tWTH 10 10 ns ns 18) 18)
Semiconductor Group
160
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
Notes:
1) All voltages are referenced to VSS. Vih may overshoot to VV + 0.2V for pulse widths of < 4ns with 3.3V. Vil may undershoot to -2.0V for pulse width < 4.0 ns with 3.3V. Pulse width measured at 50% points with amplitude measured peak to DC reference. 2) ICC1, ICC3, ICC4 and ICC6 and ICC7 depend on cycle rate. 3) ICC1 and ICC4 depend on output loading. Specified values are measured with the output open. 4) Address can be changed once or less while RAS = Vil.In the case of ICC4 it can be changed once or less during a hyper page mode cycle ( thpc). 5) An initial pause of 100 s is required after power-up followed by 8 RAS-only-refresh cycles, before proper device operation is achieved. In case of using internal refresh counter, a minimum of 8 CAS-before-RAS initialization cycles instead of 8 RAS cycles are required. 6) AC measurements assume tT = 2 ns. 7) VIH (min.) and VIL (max.) are reference levels for measuring timing of input signals. Also, transition times are measured between VIH and VIL. 8) Measured with the specified current load and 100 pF at Voh = 2.0 V and Vol = 0.8 V. 9) Operation within the tRCD (max.) limit ensures that tRAC (max.) can be met. tRCD (max.) is specified as a reference point only: If tRCD is greater than the specified tRCD (max.) limit, then access time is controlled by tCAC. 10) Operation within the tRAD (max.) limit ensures that tRAC (max.) can be met. tRAD (max.) is specified as a reference point only: If tRAD is greater than the specified tRAD (max.) limit, then access time is controlled by tAA. 11) Either tRCH or tRRH must be satisfied for a read cycle. 12) tOFF (max.) and tOEZ (max.) define the time at which the outputs achieve the open-circuit condition and are not referenced to output voltage levels. 13) Either tDZC or tDZO must be satisfied. 14) Either tCDD or tODD must be satisfied. 15) tWCS, tRWD, tCWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only. If tWCS > tWCS (min.), the cycle is an early write cycle and the I/O pin will remain open-circuit (high impedance) through the entire cycle; if tRWD > tRWD (min.), tCWD > tCWD (min.), tAWD > tAWD (min.) and tCPWD > tCPWD (min.) , the cycle is a read-write cycle and I/O pins will contain data read from the selected cells. If neither of the above sets of conditions is satisfied, the condition of the I/O pins (at access time) is indeterminate. 16) These parameters are referenced to CAS leading edge in early write cycles and to WRITE leading edge in Read-Modify-Write cycles. 17) When using Self Refresh mode, the following refresh operations must be performed to ensure proper DRAM operation: If row addresses are being refresh in an evenly distributed manner over the refresh interval using CBR refresh cycles, then only one CBR cycle must be performed immediatly after exit from Self Refresh. If row addresses are being refresh in any other manner (ROR - Distributed/Burst or CBR-Burst) over the refresh interval, then a full set of row refreshed must be performed immediately before entry to and immediatey after exit from Self Refresh 18) In a Test Mode Read Cycle, the value of trac, taa, tcac and tcpa are delayed by 5 ns from the specified value. These parameters must be adjusted in Test Mode cycles by adding 5ns to the specified value. Associated timings must be adjusted by 5 ns.
Semiconductor Group
161
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRC tRAS
RAS
V IH VIL
tRP
tCSH tRCD tRSH tCAS tRAL
tCRP
V IH
CAS
VIL
tRAD tASR tASC tCAH
Column
tASR
Row
Address
V IH VIL
Row
tRCH tRAH tRCS tRRH tAA tOEA
WE
V IH VIL
OE
V IH VIL
tDZC tDZO tCAC tCLZ
Hi Z
tCDD tODD
I/O (Inputs)
V IH VIL
tOFF tOEZ
Valid Data Out Hi Z
I/O (Outputs) V
V OH OL
tRAC
"H" or "L"
WL1
Read Cycle
Semiconductor Group
162
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRC tRAS
RAS
V IH VIL
tRP
tCSH tRCD tRSH tCAS tRAL tCAH
Column
tCRP
V IH
CAS
VIL
tRAD tASR tASC
tASR
Row
Address
V IH VIL
.
Row
tRAH
WE
V IH VIL
tWCS t WP
tCWL
tWCH tRWL
OE
V IH VIL
tDS
I/O (Inputs)
V IH VIL
tDH
Valid Data In
OH I/O (Outputs) V OL
V
Hi Z
"H" or "L"
WL2
Write Cycle (Early Write)
Semiconductor Group
163
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRC tRAS
RAS
V IH VIL
tRP
tCSH tRCD tRSH tCAS tRAL
tCRP
V IH
CAS
VIL
tRAD tASR tASC tCAH
Column
tASR
Row
V IH
.
Address V IL
Row
tRAH
WE
V IH VIL
tCWL tRWL tWP
tOEH
OE
V IH VIL
tDZO tDZC
I/O (Inputs)
V IH VIL
tODD tDS tOEZ tCLZ tOEA
tDH
Valid Data
OH I/O (Outputs) V OL
V
Hi-Z
Hi-Z
"H" or "L"
WL3
Write Cycle (OE Controlled Write)
Semiconductor Group
164
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRWC tRAS
V IH VIL V IH
tRP
RAS
tCSH tRCD tRSH tCAS tCRP
CAS
VIL
tRAH tASR
Address
V IH VIL Row
tCAH tASC
Column
tASR
Row
tRAD
V IH
tAWD tCWD tRWD
tCWL tRWL tWP
WE
VIL
tAA tRCS
V IH
tOEA
tOEH
OE
VIL
tDZO tDZC
I/O (Inputs)
V IH VIL
tDS tDH
Valid Data in
tCLZ tCAC
tODD tOEZ
Data Out
I/O (Outputs) V OL
V OH
tRAC
"H" or "L"
WL4
Read-Write (Read-Modify-Write) Cycle
Semiconductor Group
165
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRAS
RAS
V IH VIL
tRP tRHCP tRSH tCRP
tRCD
tHPC tCRP
V IH
tCAS
tCP
tCAS
tCAS
CAS
VIL
tCSH tASR tRAH tASC
Row
tRAL tCAH tASC tCAH
Column 2
tASC tCAH
Column N
Address
V IH VIL Column 1
tRAD tRRH tRCH
tRCS
WE
VIH VIL
tOES
OE
V OH V OL
tCAC tAA tCPA
tCAC tAA tCPA
tOFF
tOEA tRAC tAA tCAC
tOEZ tCOH tCOH
Data Out 2 Data Out N
I/O IH (Output) V IL
V
tCLZ
Data Out 1
"H" or "L"
WL5
Hyper Page Mode (EDO) Read Cycle Semiconductor Group 166
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRAS
V IH
tRP tRHCP tRSH tCRP
tRCD
RAS
VIL
tHPC tCRP
V IH
tCAS
tCP
tCAS
tCAS
CAS
VIL
tCSH tASR tRAH tASC
Row
tRAL tCAH tASC tCAH
Column 2
tASC tCAH
Column N
Address
V IH VIL Column 1
tRAD tRRH tRCH tCAC tAA tCPA tOEHC tOEHC tCAC tAA tCPA
tRCS
WE
VIH VIL
tOES
V OH V OL
tOFF
tOEA tRAC tAA tCAC
OE
tOEP tOEZ
tOEA
tOEP tOEA tOEZ tOEZ
Data Out 2 Data Out N
I/O IH (Output) V IL
V
tCLZ
Data Out 1
WL6
"H" or "L"
Hyper Page Mode (EDO) Read Cycle (OE Control)
Semiconductor Group
167
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRAS
V IH
tRP tRHCP tRSH tCRP
tRCD
RAS
VIL
tHPC tCRP
V IH
tCAS
tCP
tCAS
tCAS
CAS
VIL
tCSH tASR tRAH tASC
Row
tRAL tCAH tASC tCAH
Column 2
tASC tCAH
Column N
Address
V IH VIL Column 1
tRAD
tAA
tAA tRCH tRRH tRCH tRCS
tRCS
WE
VIH VIL
tRCH
tRCS
tWPZ tOES
OE
V OH V OL
tCAC tCPA
tWPZ
tCAC tCPA tOFF
tOEA tRAC tAA tCAC
tOEZ tWHZ tWHZ
I/O IH (Output) V IL
"H" or "L"
V
tCLZ
Data Out 1 Data Out 2 Data Out N
WL7
Hyper Page Mode (EDO) Read Cycle (WE Control)
Semiconductor Group
168
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRAS
V IH
tRP tRHCP tRSH tCRP
tRCD
RAS
VIL
tHPC tCRP
V IH
tCAS
tCP
tCAS
tCAS
CAS
VIL
tCSH tASR tRAH tASC
Row Addr
tRAL tCAH tASC tCAH
Column 2
tASC tCAH
Column N
Address
V IH VIL
Column 1
tRAD tCWL tWCS
VIH VIL
tCWL tWCH tWP tWCS
tRWL tCWL tWCH tWP
tWCH tWCS tWP
WE
OE
V OH V OL
tDS
V IH
tDH
tDS
tDH
tDS
tDH
I/O (Input) V IL
Data In 1
Data In 2
Data In N
"H" or "L"
WL8
Hyper Page Mode (EDO) Early Write Cycle
Semiconductor Group
169
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRAS
V IH
tRP
tRCD tRSH tCP tCAS tCP tCAS tCRP
RAS
VIL
tHPC tCRP
V IH
tCAS
CAS
VIL
tCSH tASR tRAH tASC
Row
tRAL tCAH tASC tCAH
Column 2
tASC tCAH
Column N
Address
V IH VIL Column 1
tRAD
tCWL tRCS
tCWL tRCS
tCWL tRWL
tRCS
WE
VIH VIL
tWP tOEH
OE
V OH V OL
tWP tOEH
tWP tOEH
tODD tDS tODD tDH tDS tDH
tODD tDS tDH
I/O (Input)
V IH VIL
Data In 1
Data In 2
Data In N
WL16
"H" or "L"
Hyper Page Mode (EDO) Late Write Cycle
Semiconductor Group
170
tRASP tRP tPRWC tCP tCAS tCAS tCAH tASC tASC
Column Row Column
V
RAS
IH
V IL
tCSH tRSH tCAS tRAL tCRP
Semiconductor Group
tRCD
V
CAS
IH
V IL
tRAD tCAH tASC
Column
tASR
tRAH
tCAH
tASR
V
Address
IH
V IL
Row
V
tRCS tAA tOEA tOEA tWP tWP tOEA tAWD tAWD tAWD
tRWD tCWD tCWL tCWL
tCPWD tCWD
tCPWD tCWD
tRWL tCWL
WE
IH
Hyper Page Mode (EDO) Read-Modify-Write Cycle
171
V IL
tWP
V
IH
OE
V IL
tCPA tDZC
Data In
tCPA tODD
Data In
V
IH
tDZC tCLZ tDZO tCLZ tCAC tRAC tOEZ tDH tDS
Data Out Data Out
tDZC tCLZ tOEH
tODD
Data In
I/O (Inputs) V IL
tODD tAA
tOEH tOEZ tDS tDH
tOEH tCAC tAA tDS
Data Out
tDH
OH I/O (Outputs) V
V
OL
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
WL17
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRC tRAS
RAS
V IH VIL
tRP
tCRP tRPC
V IH
CAS
VIL
tRAH tASR
tASR
Row
Address
V IH VIL
Row
OH I/O (Outputs) V OL
V
HI-Z
"H" or "L"
WL9
RAS Only Refresh Cycle
Semiconductor Group
172
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRC tRP
RAS
V IH VIL
tRAS
tRP
tRPC tCP
tCSR tCHR tRPC
tCRP
CAS
V IH VIL
tWRP tWRH
V IH VIL
WE
tOEZ
OE
V IH VIL
tCDD
I/O (Inputs)
V IH VIL
tODD
OH I/O (Outputs)VOL V
HI-Z
tOFF
"H" or "L"
WL10
CAS-before-RAS Refresh Cycle
Semiconductor Group
173
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRC
V IH VIL
tRC tRP tRAS tRP
tRAS
RAS
tRCD
V IH VIL
tRSH tCHR tCRP
CAS
tRAD tASC tASR tRAH
Row
tWRP tCAH tWRH tASR
Row
Address
V IH VIL
Column
tRCS
WE
V IH VIL
tRRH
tAA tOEA
OE
V IH VIL
tDZC tDZO
tCDD tODD tCAC tCLZ
I/O (Inputs)
V IH VIL
tOFF tOEZ
Valid Data Out HI-Z
tRAC
OH I/O (Outputs) V OL V
"H" or "L"
WL11
Hidden Refresh Read Cycle
Semiconductor Group
174
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRC tRP
RAS
V IH VIL
tRC tRAS tRP
tRAS
tRCD
V IH VIL
tRSH
tCHR
tCRP
CAS
tRAD tRAH tASR tASC tCAH
Column
tASR
Row
Address
V IH VIL
Row
tWCS
tWCH tWP
tWRP
tWRH
WE
V IH VIL
tDS
I/O (Input)
V IH V IL
tDH
Valid Data
OH I/O (Output) V OL
V
HI-Z
"H" or "L"
WL12
Hidden Refresh Early Write Cycle
Semiconductor Group
175
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRP
RAS
V IH VIL
tRASS
tRPS
tRPC tCSR
CAS
V IH VIL
tCHS
tCRP
tCP
tWRP tWRH
WE
V IH VIL
OE
V IH VIL
tCDD
I/O (Inputs)
V IH VIL
tODD tOEZ
OH I/O (Outputs) V OL
V
HI-Z
tOFF
"H" or "L"
WL13
Self Refresh (Sleep Mode)
Semiconductor Group
176
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRP
RAS
V IH VIL
tRC tRAS tRP
tRPC tCP tCSR tCHR tRPC tCRP
CAS
V IH VIL
tASR tRAH
Address IH
VIL V
Row
tWTS
WE
V IH VIL
tWTH
OE
V IH VIL
I/O (Inputs) V IL
V IH
tODD
HI-Z
tCDD tOEZ
I/O (Outputs) V
V OH OL
HI-Z
tOFF
"H" or "L"
WL15
Test Mode Entry Cycle
Semiconductor Group
177
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
tRAS
Read Cycle:
RAS
V IH V IL
tRP
tCSR
CAS
V IH V IL
tCHR
tCP
tRSH tCAS tRAL
tASC
Address
V IH V IL
tCAH tAA tCAC
tASR
Row
Column
tWRP
WE
V IH V IL V IH V IL V IH V IL VOH VOL
tRRH tOEA tCDD tOFF
tRCH
tWRH
tRCS tDZC tDZO tCLZ
OE I/O (Inputs)
tODD tOEZ
Data Out
I/O (Outputs)
tWRP
Write Cycle:
WE
V IH V IL
tWCS
tRWL tCWL tWCH
tWRH
OE
V IH V IL
tDS
I/O (Inputs) I/O (Outputs)
V IH V IL V IH V IL
tDH
Data In
HI-Z
CAS-before-RAS Refresh Counter Test Cycle
Semiconductor Group
178
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
Package Outlines P-SOJ-34-1 (500 mil) (Plastic Small Outline J-leaded Package)
Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book "Package Information". SMD = Surface Mounted Device Semiconductor Group 179
Dimensions in mm
HYB3164(5)805J/T(L)-50/-60 8M x 8 EDO-DRAM
P-TSOPII-34-1 (500 mil) (Plastic Thin Small Outline Package Type II
Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book "Package Information". SMD = Surface Mounted Device Semiconductor Group 180
Dimensions in mm

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